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PCB has a sensor for every stage of semiconductor manufacturing—from wafer preparation and processing to etching and dicing and final inspection. When you need precise, real-time data, rely on PCB for unbeatable value, best warranty, and fast shipment. We verify every sensor with rigorous specification testing in A2LA accredited, ISO/IEC 17025 calibration labs to ensure that our quality standards meet yours.
Our precision accelerometers and force sensors are used for many different applications, including:
PCB's force sensors offer optimal frequency response for precise control during wafer preparation, even as thinner wafers are needed to meet demand for smaller sizes in consumer electronics.
High sensitivity, low noise accelerometers monitor equipment vibration in the lithography process, ensuring high quality applications to the wafer surface.
High precision force sensors control the amount of force applied during cutting and dicing processes, ensuring optimum product yield and durability.
Force sensors are used to ensure package material is evenly applied and that die and wire bonds are not damaged in the process.
Measure extremely low frequency vibrations.
Measure high frequency dynamic compression, tension, and force events.
Measure dynamic compression and tension forces over a wide temperature range.
Measure low frequency vibration down to true DC.
As a leading sensor manufacturer for over 60 years and inventor of ICP® technology, PCB is proud to support fellow testing professionals. Our Total Customer Satisfaction guarantee means our application engineers are available 24/7 to provide expert advice throughout your sensor selection and testing process.
PCB strives to provide continuous education for testing professionals and customers. You can view all PCB white papers by clicking here, and all upcoming educational webinars, here. Some topics that might interest you are:
Download our brochure to browse our most popular sensors for semiconductor manufacturing.